Pressed Ceramics for LED products
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Description
We supply all-round types of sealing lid for various packages including ceramic and others. As for the sealant, we offer wide variety of material, glass and epoxy etc. We can also pre-assemble image sensor packages (CMOS, CCD) in cerdip type, by combination of ceramic substrate, lead frame and sealants - - glass or epoxy.
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Pressed Ceramics for LED products
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